Copper Plating Brightener SPS/Bis-(sodium Sulfopropyl)-disulfide Cas 27206-35-5

SPS can effectively enhance both the tensile strength and hardness of electrolytic copper foil. As the concentration of added SPS increases, the grain size of the electrolytic copper refines, while its hardness and elastic modulus increase. Conversely, when the SPS concentration is reduced—resulting in relatively larger grain sizes within the electrolytic copper—the material’s fatigue performance is improved.

SPS serves as an effective brightener and leveling agent, capable of boosting the tensile strength and elongation of copper foil; however, it may also induce warping in the foil. As an anionic surfactant, SPS forms coordination salts with copper ions, thereby facilitating the stabilization of the interfacial film and altering the mode of grain growth. This process significantly increases the density of microscopic peaks on the rough side of the copper foil while simultaneously reducing their height, resulting in a substantial reduction in the surface roughness of the rough side.

In the copper foil manufacturing process, SPS acts as an exceptional grain refiner. When used in combination with non-ionic surfactants, polyamine- and polyether-based compounds, and certain sulfur-containing compounds, the resulting additive formulation exhibits excellent long-term stability, generates minimal decomposition byproducts, and is consumed at a low rate.