Evonik ALBIFLEX 297 epoxy silicone copolymer sealing adhesive for electronic packaging

Evonik ALBIFLEX 297 Parameters:
Silicone Content [wt%]: 40
Base Resin: Bisphenol A Epoxy
Epoxy Equivalent Weight [g/eq]: 850
Dynamic Viscosity: 45,000

Product Advantages:
Suitable for elastic formulations
Excellent adhesion to a variety of substrates
Can pass rigorous humidity and heat resistance tests
Excellent resistance to solvents and chemicals

Applications:
UV-curable adhesives, optical LOCA adhesives
Chip bonding, underfill, electronic packaging, electrical adhesives
Sensor sealing and bonding

Application: ALBIFLEX® is used as a base resin in elastic adhesives, sealants, encapsulants, coatings, and similar formulations. Due to the high silicone content of the copolymer, its miscibility with epoxy resins is limited and should be tested accordingly (relative to all liquid components in the formulation, excluding fillers).

Package:1kg、20kg