Bisphenol a Ethoxylate Dimethacrylate CAS 41637-38-1 Wholesale Price Factory Supply10EO-BPADMA

(1) 3D Printing

10EO-BPADMA possesses a rigid bisphenol A backbone and flexible ethoxylated segments, enabling the formation of a structure with both high strength and toughness. Simultaneously, the ethoxylated segments impart flexibility and processing fluidity to the material. Furthermore, the presence of methacrylate double bonds at both ends allows for photopolymerization in 3D printing. This balanced molecular design helps maintain interlayer bonding and resistance to deformation during the printing process.

(2) UV Coatings

10EO-BPADMA contains two methacrylate double bonds that can participate in photopolymerization. Its moderate viscosity allows it to be used as an reactive diluent in coating formulations, providing excellent adhesion and durability, while also improving the flexibility and chemical resistance of the coating. The rigid benzene ring structure in 10EO-BPADMA imparts high hardness and heat resistance to the material. Increasing the degree of ethoxylation enhances the hydrophilicity of the coating, helping to improve its wettability and leveling properties on polar substrates and reduce surface defects (such as orange peel and pinholes).

(3) High-Temperature Anaerobic Adhesives

General-purpose anaerobic adhesives typically have a heat resistance temperature of around 150℃, therefore, the substances in this formulation must possess high-temperature resistance. 10EO-BPADMA contains a benzene ring structure in its main chain and exhibits conjugation. The stereochemical structure of the benzene ring enhances the crosslinking density of the polymer, thus requiring good heat resistance for its application in high-temperature anaerobic adhesives.

(4) Photosensitive Dry Films

The bisphenol A structure (benzene ring) in 10EO-BPADMA possesses excellent hydrophobicity and rigidity, while the ethoxy group imparts suitable hydrophilicity, flexibility, and low shrinkage, meeting the manufacturing requirements of high-density circuit boards and reducing the risk of circuit breakage during handling or processing. When used in conjunction with alkali-soluble resins (which provide film-forming properties and adhesion), 10EO-BPADMA can adjust the hydrophilic-hydrophobic balance of the system, optimizing the permeability of the developer, thereby achieving rapid film removal without residue.

(5) Optical Materials

The bisphenol A backbone in 10EO-BPADMA has an aromatic ring structure, which provides a high refractive index (typically above 1.54), making it suitable for high-refractive-index optical materials, such as spectacle lenses and optical thin films. The ethoxylated monomer can significantly reduce the curing shrinkage rate of the material, thereby reducing the deformation risk of optical components (such as lenses and waveguides) and ensuring high dimensional stability of the material.