Supply High Quality 3.3″, 4.4″-Biphenyltetracarboxylic Dianhydride BPDA CAS 2420-87-3

BPDA serves as a core raw material for the manufacture of high-performance polyimide films (such as Upilex-S). Polyimide films formed through the polymerization of BPDA with *para*-phenylenediamine (PPD) exhibit an extremely low coefficient of thermal expansion (CTE) and exceptional thermal stability, enabling them to maintain dimensional stability even in high-temperature environments. Consequently, they are widely utilized in flexible printed circuit boards (FPCs), copper-clad laminates (CCLs), and thermal insulation materials within the aerospace sector.

Polyimide resins synthesized from BPDA possess superior dielectric properties and chemical resistance; they are extensively employed as interlayer dielectric (ILD) films, buffer layers (BCB), and chip encapsulation materials in semiconductor fabrication. These resins effectively address issues related to thermal expansion matching and heat dissipation in electronic packaging, thereby enhancing the reliability and operational lifespan of semiconductor chips.

BPDA acts as a key monomer in the preparation of photosensitive polyimides (PSPI). PSPI photoresists—characterized by their high resolution, low shrinkage, and excellent adhesion—play a pivotal role in micro-electromechanical systems (MEMS), 3D integrated circuit (3D IC) packaging, and general semiconductor manufacturing processes. BPDA imparts rigidity and thermal stability to the polymer backbone, thereby helping the photoresist maintain its structural integrity throughout complex fabrication sequences.